ISL8009AIRZ-T INTERSIL

$1.75

Conv DC-DC Single Step Down 2.7V to 5.5V 8-Pin DFN EP T/R

  • In Stock QTY: 3000
  • Warehouse: San Jose, CA, USA
  • Part#: ISL8009AIRZ-T
  • Manufacturer: INTERSIL
  • Pack Size: 1 – REEL

Specsheet

IC REG BUCK ADJ 1.5A SYNC 8DFN

Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 1.5A 8-VFDFN Exposed Pad

Lead free / RoHS Compliant

$0.26

EEPROM Serial-I2C 512K-Bit 64K x 8 3.3V/5V 8-Pin TSSOP

  • In Stock QTY: 12474
  • Warehouse: San Jose, CA, USA
  • Part#: M24512-WDW6TP
  • Manufacturer: STMICROELECTRONICS
  • Pack Size: 1 – R

M24512-WDW6TP STMICROELECTRONICS STMICROELECTRONICS EEPROM Serial-I2C 512K-Bit 64K x 8 3.3V/5V 8-Pin

For available date codes, please Call (408-287-6041) or Email (jay-r@dfsales.com)!

39-30-2045 MOLEX

$0.40

CONNECTOR, 4 CIRCUITS, MINI-FIT, HEADER, SINGLE ROW

  • In Stock QTY: 16466
  • Warehouse: San Jose, CA, USA
  • Part#: 39-30-2045
  • Manufacturer: MOLEX
  • Pack Size: 1 – BX

$7.00

CHAMP 050 SHELD CASE KIT 80P Always EU RoHS/ELV Compliant

  • In Stock QTY: 170
  • Warehouse: San Jose, CA, USA
  • Part#: 1-176793-0
  • Manufacturer: TE Connectivity
  • Pack Size: 1 – K

EP1S25F780C6

$800.00

  • In Stock QTY: 4
  • Warehouse: San Jose, CA, USA
  • Part#: EP1S25F780C6
  • Manufacturer: ALTERA
  • Pack Size: 36 – TRAY

EP1S25F780C6. ALTERA. IC 25660 Cells 450.05MHz 130nm Technology 1.5V 780-Pin FC-FBGA.
FPGAs is based on a 1.5-V, 0.13-µm, all-layer copper
SRAM process, with densities of up to 79,040 logic elements (LEs) and up
to 7.5 Mbits of RAM. Stratix devices offer up to 22 digital signal
processing (DSP) blocks with up to 176 (9-bit × 9-bit) embedded
multipliers, optimized for DSP applications that enable efficient
implementation of high-performance filters and multipliers. Stratix
devices support various I/O standards and also offer a complete clock
management solution with its hierarchical clock structure with up to
420-MHz performance and up to 12 phase-locked loops (PLLs)..

EPCS128SI16N ALTERA

$45.00

IC, FPGA, Configuration Memory IC – Ser. Config Mem Flash 128Mb,40 MHz

  • In Stock QTY: 75
  • Warehouse: San Jose, CA, USA
  • Part#: EPCS128SI16N
  • Manufacturer: ALTERA
  • Pack Size: 1 – R

Specsheet

EPCS128SI16N ALTERA ALTERA IC, FPGA,  Configuration Memory IC – Ser. Config Mem Flash 128Mb,40 MHz

MIT-115

$5.00

TELECOM TRANSFORMER THROUGH HOLE 24 X 23  X 12 MM 4000.0KHZ

  • In Stock QTY: 308
  • Warehouse: San Jose, CA, USA
  • Part#: MIT-115
  • Manufacturer: SUMIDA
  • Pack Size: 1 – LOOSE

AFE4403YZPR

$4.00

IC  General Purpose 1ADC 8bit 3.3V 36-Pin DSBGA NEW ROHS

  • In Stock QTY: 2625
  • Warehouse: San Jose, CA, USA
  • Part#: AFE4403YZPR
  • Manufacturer: TEXAS INSTRUMENTS
  • Pack Size: 3000 – REEL

IC AFE4403 General Purpose 1ADC 8bit 3.3V 36-Pin DSBGA  TAPE AND REEL 3000 PCS NEW ROHS

PM-L24 SUNX SENSORS

$12.00

SENSOR PHOTOELECTRIC ULT

  • In Stock QTY: 0
  • Warehouse: San Jose, CA, USA
  • Part#: PM-L24
  • Manufacturer: SUNX SENSORS
  • Pack Size: 1 – LP

For available date codes, please Call (408-287-6041) or Email (jay-r@dfsales.com)!

B048F120T30 VICOR

$105.00

Module DC-DC 1-OUT 9.5V to 13.8V 25A 300W

  • In Stock QTY: 604
  • Warehouse: San Jose, CA, USA
  • Part#: B048F120T30
  • Manufacturer: VICOR
  • Pack Size: 40 – TR

The V•I Chip™ bus converter is a high efficiency (>96%), narrow input range Sine Amplitude ConverterTM (SACTM) operating from a 38 to 55 Vdc primary bus to deliver an isolated 9.50 V to 13.8 V secondary. The bus converter may be used to power non-isolated POL converters or as an independent 9.50 – 13.8 V source. Due to the fast response time and low noise of the bus converter, the need for limited life aluminum electrolytic or tantalum capacitors at the load is reduced—or eliminated— resulting in savings of board area, materials and total system cost. The bus converter achieves a power density of 1017 W/in3 in a V•I Chip package compatible with standard pick-and-place and surface mount assembly process. The V•I Chip package provides flexible thermal management through its low junction-to-board and junction-to-case thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the bus converter does not require a discrete heat sink in typical applications. Low junction-to-case and junction-to-lead thermal impedances assure low junction temperatures and long life in the harshest environments.